Samsung, Broadcom partner with $200bn AI semiconductor MoU
Samsung Electronics has signed an Memorandum of Understanding (MoU) with Broadcom to work more closely on next-generation semiconductor technologies.
The agreement, which was signed at the AI Summit in San Francisco is expected to be worth over $200 billion across memory and foundry technologies over the next five years, through to 2030.
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As a result, the partnership will see the telecoms giant supply Broadcom with advanced memory products, including High Bandwidth Memory (HBM), which has become a key component in powering increasingly complex AI systems.
Alongside this, the companies will also work together on Samsung’s cutting-edge 2-nanometre (2nm) manufacturing process, as well as advanced chip packaging technologies designed to deliver faster, more power-efficient AI and networking chips.
According to the company, the move reflects growing pressures on chipmakers to deliver more powerful hardware as AI adoption accelerates across industries.
Beyond memory, the partnership will focus on manufacturing Broadcom’s products, including Wireless Broadband Communications (WBC) solutions, using Samsung‘s latest semiconductor processes.
The companies also plan to develop advanced 2.3D and 2.5D packaging technologies that allow multiple chips to be combined into a single, high-performance package, helping improve both speed and energy efficiency.
Samsung Electronics Vice Chairman & CEO of the Device Solutions (DS) Division, Young Hyun Jun, said: “AI is driving unprecedented demand for tightly integrated semiconductor technologies spanning memory, logic and advanced packaging.
“By expanding our collaboration with Broadcom across these critical technologies, we look forward to delivering greater value to customers while advancing the AI infrastructure of the future.”
Broadcom President of Semiconductor Solutions Group, Charlie Kawwas, said: “As AI infrastructure continues to scale, close collaboration across the semiconductor ecosystem becomes increasingly important.
“By combining Samsung’s memory and foundry expertise with Broadcom’s AI and connectivity leadership, we aim to continue to deliver technologies that power the next generation of AI infrastructure.”
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